New 16-Chip 'Multi-Stack Package' technology by Samsung offers maximum density solution - Instablogs
New 16-Chip 'Multi-Stack Package' technology by Samsung offers maximum density solution
Naresh Chauhan , Shimla: Nov 2 2006
Made Popular Nov 2 2006
To sustain the industry-wide demand for small form factors and high-densities, and to accommodate multimedia-intensive user applications, Samsung Electronics proclaimed a process, which will facilitate innovative fabrication of a 16-chip multi-chip...
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Tags: Samsung, multi Chip Package, wafer-thinning technology, laser-cutting technology
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Naveen
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Naveen bornrich.org/ Nov 2 2006
Shimla, India
Whoa! that’s indeed an innovation that fits apt for the tech gadgets that are going slimmer day by day. The mixing of the unique 16-chip multi-chip package with the LG’s recently announced slimmest screen could make a fabulous cellphone!
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Anupam Agnihotri
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Anupam Agnihotri bodyofwealth.com Nov 2 2006
Shimla, India
Hey!..... Naresh, I think this is a fantastic revelation and thanks a lot for provinding me such an important informaiton about it.
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Ashutosh
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Ashutosh Nov 2 2006
Chandigarh, India
looks like the gadgets are getting slimmer and days are not far when laptops and the desktops will also become lighter and easier to handle. just one question when are they going to release it in the market, but any how good work samsung
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Yash
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Yash Nov 2 2006
Gwalior, India
gud going Sam.... the race of data compression is on and lets see who get the top rank in chart for innovative slimmest appliance...hope SAM will!!!
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